Page 57 - Vol.13

機
需求 需求
5D
ISO/PID
3D 2D

機

機

機
台
機

Tool layout Tool con guration
機台 機

機台

Hookup drawings layout Integration

參考文獻
[1] TSMC OI Document : Tool installation
sign-off O.I.(A-RMS-07-03-181).
[2] Vol.1 : 5D Fab (TSMC
5D Fab Development Retrospection).
[3] 5D http://crystal5d.com/
用
[4] Martin Fischer, June 2008,The
Journal of Information Technology
用  in Construction, BENEFITS
 AND LES SONS LEARNED OF
 IMPLEMENTING BUILDING VIRTUAL
 案 DESIGN AND CONSTRUCTION (VDC)

 TECHNOLOGIES FOR COORDINATION
 OF MECHANICAL, ELECTRICAL, AND
PLUMBING (MEP) SYSTEMS ON A

LARGE HEALTHCARE PROJECT.
[5] C.C. Sullivan, Integrated BIM and

用 Design Review for Safer, Better
 Buildings.
 [6] Wei-Chih Wang, 2012, Application
of F ALCON and fmGA to cost
 案
estimation for semiconductor hookup
construction.

NEW FAB ENGINEERING JOURNAL MARCH 2014 57