Page 81 - Vol.44
P. 81

TSMC / FACILITY PUBLISHED
                VOL.44
                                                         廠務季刊


                                                          URL.http://nfjournal/



                腐蝕性特氣元件PM精進-控制環境濕度,解決元件更換腐蝕問題

                Enhancement of Parts Replacement of Corrosive Gas-Control Ambient Humidity to
                Solve Corrosion Issue


                                                                                                 文│陳建佑│新竹廠務一部│


                摘要 / Abstract

                    腐蝕性特殊氣體(特氣)為半導體產業中常見的化學品,其在更換特氣元件的過程易與空氣中水氣產生酸性的腐蝕化合物,造
                成人體或設備元件有接觸腐蝕及不純物汙染的風險。本研究以更換氯氣(Cl 2 )氣體分配箱(valve Manifold Box, VMB)內的調壓閥為
                例,探討更換腐蝕性特氣元件時的環境濕度與腐蝕性汙染物生成的關係,計算出環境濕度需於10%以下,並在10分鐘內完成更換
                方能避免更換過程形成的腐蝕性不純物濃度高於Certification of Analysis(CoA)所標示之不純物濃度。在實際更換調壓閥前,先以
                混合氣(O 2 /N 2 )吹入通風罩(Cover)中降低環境濕度後,於10分鐘內完成調壓閥更換,同時以有毒氣體偵測器(TLD-1)確認更換過程
                中無氯氣及含氯化合物的讀值。本研究可應用於腐蝕性特氣元件的更換,作為廠務端於特氣元件更換的安全及汙染風險控管的
                參考案例。

                關鍵詞 / 腐蝕性氣體、氯氣、環境濕度、元件更換

                    Corrosive special gas is commonly used chemicals in semiconductor industry, and it would react with moisture
                to make corrosive acidic compound during the replacement of parts. In this research, we take the replacement of the
                regulator in chlorine VMB for example and investigate the relationship between ambient humidity and the production
                of corrosive pollutants. According to the theory, the concentration of corrosive impurities would be higher than the
                impurities concentration labeled on the COA while replacing parts within 10 minutes in case the ambient humidity
                is below 10%. In the experiment, the mixed gas was channeled into the cover to decrease ambient humidity before
                replacing regulators, and make sure the replacement was finished within 10 minutes. The concentration of chlorine and
                chloring-containing compounds was detected by TLD-1 throughout the process. This research provides the profound
                insight for the safety and containment risk control for replacing parts of corrosive special gas.

                Keywords / Corrosive gas, Chlorine, Ambient humidity, Parts replacement



                1.  前言

                    在半導體產業中,特殊氣體扮演生產過程的重要角色,                       •  溴系 : HBr
                以因應製程的不同需求。特殊氣體可依其化學性質分為腐蝕                         •  其他 : NH 3 、N 2 O
                性、可燃性、助燃性、毒性、惰性氣體等,其中腐蝕性氣體因
                                                                       在200mm廠區,因廠務系統運轉時間長,特氣元件因使
                其化學結構特性,易與水分接觸後水解產生HCl或HF等酸性腐
                                                                   用年限因素而待需更換。腐蝕性特氣元件在更換過程時,管件
                蝕性化合物,而對於設備中的管路閥件或人體的皮膚及呼吸系
                                                                   內的殘留氣體會曝露於空氣中而與空氣中的水分反應產生腐蝕
                統造成腐蝕作用,常見的腐蝕性氣體可分為下列 :
                                                                   性化合物,造成更換人員有接觸或吸入腐蝕性氣體之風險外,
                                                                   並有腐蝕管件內部之金屬元件造成內部汙染之虞。
                •  氯系 : HCl、Cl 2 、BCl 3 、SiH 2 Cl 2 、SiCl 4
                •  氟系 : F 2 、BF 3 、ClF 3 、NF 3 、WF 6 、SiF 4

                                                                                             FACILITY JOURNAL        12  2021  79
   76   77   78   79   80   81   82   83   84   85   86