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廠務季刊 Facility Journal 2023

品質監控_化學研磨液系統分析儀器突破性發展
Quality control_breakthrough development of analytical instrument for
slurry dispense system
文│曾誌江 葉俊宏│廠務技術發展部

摘要

摘要 半導體先進製程 _CMP 化學機械研磨，所使用之 Slurry 研磨
液品質與 CMP defects 息息相關，如何適當地分析研磨液品
1. 前言
質更顯得重要。研磨液其組成除了包含研磨粒子之外，還包括
2. 文獻探討 一些少量且不同功能的化學品，例如 : Passivation agents/
Oxidizers/ Inhibitors/ Dispersants/ Chelating agent/
2.1 化學品研磨液新鮮度
Surfactants/pH buffer， 目 前 在 既 有SDS(Slurry Dispense
對於生產的影響
System) 安裝之線上分析儀，不外乎酸鹼性pH計/ 比重計/ 導
2.2 化學品純度
電度計/ 雙氧水分析儀器，這些既有的分析儀器，無法完全的
對於生產的影響 表現出研磨液的輸送品質，本研究利用光學與電化學的原理去
呈現研磨液的 Pattern「圖案」，將分析儀器安裝於 SDS，收
3. 分析儀原理介紹
集與建立符合運轉需求的 baseline，以達到研磨液品質預警
3.1 化學品Pot Life分析儀(CPL) pre-alert 機制。
3.2 化學品純度分析儀(CPA)
關鍵詞 : CMP、Slurry、SDS、分析儀
4. 案例探討
Semiconductor Advanced Process_CMP Chemical
4.1 化學品Pot Life分析儀(CPL) Mechanical Polishing. The quality of the slurry is highly
4.2 化學品純度分析儀(CPA) correlated with CMP defects, which indicates the
importance of quantifying slurry quality for controlling
5. 結論 CMP defects. In addition, the composition of the
slurry also includes some complex chemicals, such as
參考文獻 Passivation agents/ Oxidizers/ Inhibitors/ Dispersants/
Chelating agent/ Surfactants/ pH buffer. Currently, online
作者介紹
meters in SDS(Slurry Dispense System), such as acid-base
pH meters/ specific gravity meters/conductivity meters/
hydrogen peroxide titrators cannot fully reflect the quality
of the slurry delivering in SDS. Therefore, this study
proposes two analytical instruments based on optical and
electrochemical principles to quantify the unique �pattern�
of the slurry, and also applying the instruments into a real
case to investigate its suitability for slurry. In addition,
instruments are installed in the SDS to establish operation
baseline, in order to provide a pre-alert mechanism for
better control the CMP defects.
➀ 缺作者介紹。
Keywords : CMP, Slurry, SDS, Ananlyzer
[02]~[04]
➁ 參考文獻 ，未在文中提到。
➂ 圖表若覺得不清楚，請提供原始檔。

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