Page 76 - Vol.13
P. 76

New
             Vision
             新象新知







               and the lower priority data will be digested and analyzed with   450mm Fab. Definitely, nobody will
               statistical methodologies to filter out useful correlation linkages   try to set up the air in the whole Fab to
               in a separated processing system. Newly finding correlation   meet this requirement since it will be
               linkages will be organized back to main system for further   both costly and dangerous. The focus
               parallel identification and certification until adequate data   will just put on wafer transportation
               quantity can answer the reliable correlations, and then this   route to meet this ultra-low condition.
               system will add those newly findings to work with main system   Certainly, the other benefit is AMC
               APC or related systems. By this “Organized Big Data” concept,   (Airborne Molecular Contaminant)
               extracted data can become information, and the learning     a n d  VO C s  ( Vo l a t i l e  O r g a n i c
               capability can generate more useful information. Of course, this   Compounds) impacts can be lowered
               also can help to dump really useless data to save cost on data   to some level.
               storage.
                                                                           Fully automation is a must for 450mm
               A precise and accurate metrology also becomes more important   Fab operation due to the weight of
               in advanced technology node, especially below 40nm technology   each tool or device increasing a lot.
               node. Those metrology used in Lab now have become the baseline   In 300mm FOUP (Front Opening
               in production line, like XRR, XRD, XRF and XPS. Integrated   Unified  Pod),  there  is  a  pair  of
               metrology seems one of the solutions. A common platform could   handlers, but 450mm FOUP or MAC
               integrate various solutions from different metrology suppliers.   (Multiple Application Carrier) has no
               Since shorter queue time is necessary to protect process quality   such a design from the very beginning.
               during inline monitor and short wavelength light source for   The main reason is that the empty
               better resolution, a vacuum measurement condition can protect   weight of 450mm FOUP or MAC is
               the whole lot, and different kind of monitors can be completed in   over 20kg, which is too heavy to be
               one platform. On the other hand, pre-layer measurement data are   handled manually and comply with
               acquired to be calculated and improve the precision. A data feed   related labor safety law. With a full-
               forward system between different metrology tools is necessary   loaded 25 450mm wafers FOUP, the
               for this purpose, and this system also plays a role to find out and     weight could be up to 25kg, even
               eliminates same type tool to tool bias or mis-match.        Rambo  cannot  handle.  Although
                                                                           operator number will be expected to
               For sure, the metrology data, including both measurement data   be zero in 450mm Fab, nevertheless
               and tool sensor data, are one of the Organized Big Data. By   equipment maintenance still needs
               this, an “Advanced Virtual Metrology (AVM)” concept could be   engineers to cover.
               applied. In 300mm Fab, the IT infrastructure is still not healthy
               enough to carry out AVM due to data quality issue. “Garbage in   Equipment engineers will encounter
               and garbage out” is the first word as we take computer science   the same situation since over 85%
               classes. Current tool side data bandwidth and Fab backbone are   parts or modules will become bigger
               not fully upgraded to optical fiber or more advanced data packet   and heavier. According to the PVD
               technology. At least, operation synchronization is still not set as   metal target supplier estimation,
               a critical requirement in current Fab.                      the weight of a PVD metal target
                                                                           will be around 80kg. This is really a
                                                                           serious issue in 450mm Fab. For wafer
               Optimized Manufacturing                                     transportation, AMHS (Automated
               Environment                                                 Material  Handling  System)  can
                                                                           work on this with no doubt, but for
                                                                           equipment periodical maintenance
                                                                           upon parts and materials replacement,
                     ecause the critical dimension of device will come down   an assistant kit must be designed
                     below 100 angstrom, there is no room for extra oxidation   and implemented to help equipment
               Bduring processes. Theoretically, Silicon can get rid of    engineers to complete their daily jobs
               oxidation within 120 minutes as both oxygen and humidity    safely.
               concentration can go below 100ppm. An ultra-low oxygen and
               humidity environment will be built up from the beginning of





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