Page 76 - Vol.13
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New
Vision
新象新知
and the lower priority data will be digested and analyzed with 450mm Fab. Definitely, nobody will
statistical methodologies to filter out useful correlation linkages try to set up the air in the whole Fab to
in a separated processing system. Newly finding correlation meet this requirement since it will be
linkages will be organized back to main system for further both costly and dangerous. The focus
parallel identification and certification until adequate data will just put on wafer transportation
quantity can answer the reliable correlations, and then this route to meet this ultra-low condition.
system will add those newly findings to work with main system Certainly, the other benefit is AMC
APC or related systems. By this “Organized Big Data” concept, (Airborne Molecular Contaminant)
extracted data can become information, and the learning a n d VO C s ( Vo l a t i l e O r g a n i c
capability can generate more useful information. Of course, this Compounds) impacts can be lowered
also can help to dump really useless data to save cost on data to some level.
storage.
Fully automation is a must for 450mm
A precise and accurate metrology also becomes more important Fab operation due to the weight of
in advanced technology node, especially below 40nm technology each tool or device increasing a lot.
node. Those metrology used in Lab now have become the baseline In 300mm FOUP (Front Opening
in production line, like XRR, XRD, XRF and XPS. Integrated Unified Pod), there is a pair of
metrology seems one of the solutions. A common platform could handlers, but 450mm FOUP or MAC
integrate various solutions from different metrology suppliers. (Multiple Application Carrier) has no
Since shorter queue time is necessary to protect process quality such a design from the very beginning.
during inline monitor and short wavelength light source for The main reason is that the empty
better resolution, a vacuum measurement condition can protect weight of 450mm FOUP or MAC is
the whole lot, and different kind of monitors can be completed in over 20kg, which is too heavy to be
one platform. On the other hand, pre-layer measurement data are handled manually and comply with
acquired to be calculated and improve the precision. A data feed related labor safety law. With a full-
forward system between different metrology tools is necessary loaded 25 450mm wafers FOUP, the
for this purpose, and this system also plays a role to find out and weight could be up to 25kg, even
eliminates same type tool to tool bias or mis-match. Rambo cannot handle. Although
operator number will be expected to
For sure, the metrology data, including both measurement data be zero in 450mm Fab, nevertheless
and tool sensor data, are one of the Organized Big Data. By equipment maintenance still needs
this, an “Advanced Virtual Metrology (AVM)” concept could be engineers to cover.
applied. In 300mm Fab, the IT infrastructure is still not healthy
enough to carry out AVM due to data quality issue. “Garbage in Equipment engineers will encounter
and garbage out” is the first word as we take computer science the same situation since over 85%
classes. Current tool side data bandwidth and Fab backbone are parts or modules will become bigger
not fully upgraded to optical fiber or more advanced data packet and heavier. According to the PVD
technology. At least, operation synchronization is still not set as metal target supplier estimation,
a critical requirement in current Fab. the weight of a PVD metal target
will be around 80kg. This is really a
serious issue in 450mm Fab. For wafer
Optimized Manufacturing transportation, AMHS (Automated
Environment Material Handling System) can
work on this with no doubt, but for
equipment periodical maintenance
upon parts and materials replacement,
ecause the critical dimension of device will come down an assistant kit must be designed
below 100 angstrom, there is no room for extra oxidation and implemented to help equipment
Bduring processes. Theoretically, Silicon can get rid of engineers to complete their daily jobs
oxidation within 120 minutes as both oxygen and humidity safely.
concentration can go below 100ppm. An ultra-low oxygen and
humidity environment will be built up from the beginning of
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