Page 16 - Vol.47
P. 16
Tech
Notes
技術專文
TSMC / FACILITY PUBLISHED
VOL.47
廠務季刊
URL.http://nfjournal/
8吋成廠區在LSC拆裝的空間位置突破-以8廠為例
The Breakthrough in the Spatial Location of Local Scrubber
文│曾能駿 李家維 謝穎至│新竹廠務一部│
摘要 / Abstract
F8從世大建廠之初運轉至今已超過20年，隨著半導體產業日新月異及製程的進步，產能需求銳不可擋，如何在有限的空間
把機台安裝效率最大化已成為製造生產端、設備機台端與廠務運轉端最大挑戰。本文旨在分享及介紹F8拆裝機過程的規劃，從
初始的廠務端自我空間規畫、動線安排及工序精進的突破，至生產及設備機台端的統整與調度。F8廠區因空間限制，導致現址
式尾氣處理設備(Local Scrubber, LSC)安裝覆蓋率低，為求空間最大化應用，LSC安裝最佳化方案，以2個chamber合併進入LSC
單一inlet port，爭取30% LSC安裝空間，不僅將CVD製程LSC安裝覆蓋率提升為100%，亦不會影響製程主機台建壓效果。同時將
LSC錯誤安裝於變電站區域，矯正至無塵室機械區。藉此方法除了可提升F8 LSC的去除效率，也可同時達到符合廠內產能需求、
綠色製造及近零排放的雙贏理念。
關鍵詞 / 空間規劃、現址式尾氣處理設備、綠色製造
Taiwan Semiconductor Manufacturing Company(TSMC) FAB8 has been in operation for more than 20 years since
the establishment of the Worldwide Semiconductor Manufacturing Corporation(WSMC). With the advancement of the
semiconductor industry and manufacturing processes, the demand for production capacity is unstoppable. How to maximize the
efficiency of machine installation in a limited space has become the biggest challenge between the production, equipment and
facility. This article aims to share and introduce the F8 installation plan among the planning of facility, the arrangement of moving
line, and the breakthrough of process refinement. Due to space constraints in the F8, the coverage of Local Scrubber(LSC)
installation is lower than 100%. In order to maximize the application space and LSC installation optimization scheme, merging
two chambers into a single inlet port of LSC could strive for 30% of LSC installation space. At the same time, the wrongly installed
LSC in the transformer substation area were corrected to the clean room mechanical area. This method not only increases the
LSC installation coverage of CVD process to 100% within no effect on the dry pump pressure, but also improves the removal
efficiency of the LSC to achieve the win-win concept of the production capacity and green manufacturing.
Keywords / Spatial Location, Local Scrubber, Green Manufacturing
1. 前言
F8運轉至今已超過20年，隨著半導體產業日新月異及製 本文內容將詳細分享並介紹F8近期在裝機評估過程，從
程的進步，產能需求日益增大，再加上近年來環境議題備受重 廠務端自我空間安排、動線規劃及工序精進，至生產及設備機
視，與我們最相關的半導體製造業之空污排放標準法規也逐漸 台端三方面的統整與調度，達成廠區產能需求最佳化外，也藉
加嚴，要配合產能提升且廠內有限空間機台擴充頻繁，持續維 此將舊有運轉超過20年且效率差的LSC進行汰換，提升空氣污
持且強化空污改善已成為製造生產端、設備機台端與廠務運轉 染物的去除效率，最終達到空污減量與綠色製造之目的。
端現階段最大的挑戰。
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