Page 20 - Vol.45
P. 20

Tech
                                                                                                    Notes
                                                                                                    技術專文


                                                  TSMC / FACILITY PUBLISHED
           VOL.45
                                                   廠務季刊


                                                     URL.http://nfjournal/



           日趨嚴謹空污法規對於成廠區LSC之精進改善

           With more strictly air pollution regulations, Local Scrubber improve strategy for
           aged operation Fab


                                                                                       文│盧泓佑 康智翔│新竹廠務二部│


           摘要 / Abstract

              歷經二三十年的發展，半導體工業已經成為台灣最重要的經濟支柱之一，隨著半導體工業的高度成長，明星產業背後所隱
           藏工業污染問題也日益受到重視。各界漸漸對空污排放提高標準，而對於運轉多年半導體廠區，既設製程尾氣處理設備如何提
           升污染源去除效率以降低空污排放量為一重要的課題。
              本研究透過污染源節點分析，找出汙染源多為既設現址式尾氣處理設備(Local scrubber)處理效率不佳，配合廠區翻新計畫
           進行不符合效率之設備汰換，另也針對電漿式尾氣處理設備產生的副產物進行後段水洗改善。歷時四年的翻新計畫結果顯示，
           廠區除了減少PFCs氣體排放外，對於酸性氣體排放也減少80%，以符合日趨嚴謹的半導體空污排放法規。

           關鍵詞 / 半導體排放法規、空污減量、現址式空氣處理設備、電熱式、電漿式

              After 20 to 30 years of development, the semiconductor industry has become one of the most important economic pillars
           in Taiwan. With the high growth of the semiconductor industry, the problem  behind the star industry of industrial pollution in
           Tibet has also received increasing attention. For semiconductor factories that have been operating for many years, all sectors of
           society are gradually raising the standards for air pollution emissions. How can the exhaust gas treatment equipment be installed
           Improving the removal efficiency of pollution sources and reducing air pollution emissions are an important issue.
              In this study, through the analysis of pollution source nodes, it is found that the pollution source is mostly the inefficiency
           of Local scrubbers, which is in line with the plant renovation plan. The equipment that does not meet the efficiency is replaced,
           and the by-products generated by the plasma exhaust gas treatment equipment are also improved by post-water washing. The
           results of the four-year renovation project show that in addition to reducing PFCs gas emissions, the plant also reduces acid gas
           emissions by 80% to comply with increasingly stringent semiconductor air pollution regulations.

           Keywords / Semiconductor Emission Regulations, Air Pollution Reduction, Local Scrubber, Thermal Local Scrubber,
           Plasma Local Scrubber



           1.  前言

              既有成廠區Local Scrubber面臨老舊、效率不佳及phase             體廠大都會加裝Local Scrubber，利用高溫裂解、化學吸附及
           out問題，而日趨嚴謹的空污法規，成為成廠區改善之一大議                      水洗等方式，對危害性廢氣進行第一步的處理，去除製程端廢
           題。半導體製程相當繁雜多樣，且製程中原物料與副產物中，                       氣中的危害物，降低與它種危害物混合之爆炸風險及廢氣衍生
           含有多種危害性廢氣，依其特性大體可分為酸/鹼性、毒性、                       出的空污問題。(圖1)
           腐蝕性、有機性及一般廢氣等。而此些危害性廢氣，不只有腐
           蝕管路的風險，若與它種危害物相遇或累積大量濃度時有火災
           爆炸的危險。因此，在將廢氣排至中央廢氣處理系統前，半導

           18
   15   16   17   18   19   20   21   22   23   24   25