Page 37 - Vol.45
P. 37

TSMC / FACILITY PUBLISHED
                VOL.45
                                                         廠務季刊


                                                          URL.http://nfjournal/



                30年老廠空污健檢減量與再造友善環境

                Inspection and Re-creation a Friendly Environment for Air Pollution Reduction for
                30-year-old Factory


                                                                                                 文│魏君穎│新竹廠務一部│


                摘要 / Abstract

                    由於環境污染日趨惡化，加上近年來環保意識抬頭，各界對於污染管制紛紛提高標準，工廠廢氣的排放也受到關注。對企
                業而言，除了必須遵守空氣污染法規的要求外，如何在資源有限的情況下降低廢氣的排放量和改善防制設備發揮最大效益，更
                是首要的任務。
                    F2運轉至今已超過30餘年(since 1990)，隨著半導體排放法規不斷修改且處理設備的進步也是跳躍式的成長，傳統半導體空
                污處理設備不外乎就是中央洗滌塔(Central Scrubber)、VOC處理設備、現址式空氣處理設備(Local Scrubber)這幾種，但如何將
                這些設備的處理效率和管路分流做到極致是當前重要的課題，再加上近幾年來空污排放和減量問題也是最火熱的話題且絕對是
                未來發展的趨勢，故針對老舊廠商的空污處理設備做全面性硬體和軟體的健檢絕對是必要的，經過通盤性的健康檢查並改善和
                搭配現行的全面翻新計畫可使F2&5老舊廠區再運轉30年且符合愈來愈嚴謹的半導體排放法規。

                關鍵詞 / 半導體排放法規、空污減量、中央洗滌塔、VOC處理設備、現址式空氣處理設備

                    Due to the worsening environmental pollution and the rising awareness of environmental protection in recent years, various
                industries have raised their standards for pollution control, and the emission of factory exhaust has also attracted attention. For
                enterprises, in addition to complying with the requirements of air pollution regulations, how to reduce exhaust emissions and
                improve control equipment to maximize benefits under the condition of limited resources is the most important task. F2 has been
                running for more than 30 years(since 1990). With the continuous revision of semiconductor emission regulations and the progress of
                treatment equipment, the traditional semiconductor air pollution treatment equipment is nothing more than the Central Scrubber,
                VOC treatment equipment, and on-site air treatment equipment(Local Scrubber). However, how to maximize the processing
                efficiency and pipeline diversion of these devices is an important issue at present. In addition, the issue of air pollution emission and
                reduction has also been the hottest topic in recent years and is definitely the trend of future development. It is absolutely necessary
                to conduct a comprehensive hardware and software health check for the air pollution treatment equipment of old manufacturers. A
                comprehensive health check combined with improvements and an ongoing refurbishment program will allow the old F2&5 site to
                operate for another 30 years and comply with increasingly stringent semiconductor emissions regulations.

                Keywords / Semiconductor Emission Regulations, Air Pollution Reduction, Central Scrubber, VOCs Process System, On-
                Site Air Treatment Equipment



                1.  前言

                    半導體製造業產生的空氣污染主要為揮發性有機物以及                       有效處理，使排入大氣的污染物含量符合或優於政府規定。此
                酸鹼性氣體。F2在污染防制的做法，採用源頭分類的方式做                        外，為隨時掌握防制設備的成效及污染物排放情形，各項防制
                廢氣處理(圖1)、多段處理的最佳可行技術，對空氣污染物進行                      設備皆設有即時監控系統(RTM)及N+1備援系統，相關監控結


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