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表1、IRDS材料供應系統介面點的定義
Material POS POD POC POE POU POP
Delivery Point of Gas/ Outlet of Central Submain or VMB/ Entry to Equipment Entry to the Process Contact with
Chemical Supplier Facility System VMP Take off Valve or Sub Equipment Chamber Wafer
Ultrapure Raw water Outlet of final filtration Outlet of submain Inlet of wet bench or Inlet of wet bench Wafer in
water in UPW plant take off valve sub-equipment bath, spray nozzle, production
or connection point
to piping, which is
also used for other
chemicals
Process Chemical drum/tote/ Outlet of final filtration Outlet of VMB valve Inlet of wet bench or Inlet of wet bench Wafer in
chemicals bulk supply of chemical distribution intermediate tank bath or spray nozzle production
unit
Specialty Gas cylinder or bulk Outlet of final filtration Outlet of VMB valve Inlet of equipment Inlet of chamber Wafer in
gases specialty gas systems of gas cabinet (outlet of MFC) production
Bulk gases Bulk gas delivered on Outlet of final filtration/ Outlet of submain Inlet of equipment/ Inlet of chamber Wafer in
site or gas generator purification take off valve or sub-equipment (outlet of MFC) production
VMB valve
Cleanroom Outside air Outlet of make-up air Outlet of filters in Inlet to Gas/air in vicinity to Wafer/substrate
and AMC handling unit cleanroom ceiling mini-environment or wafer/substrate in production
sub equipment for (AMC/SMC)
AMC, outlet of the
tool filter for particles
POD—point of delivery POC—point of connection POE—point of entry POP—point of process POU—point of use VMB— valve manifold box
VMP—valve manifold post UPW—ultra pure water MFC—mass flow controller AMC—airborne molecular contamination SMC—surface molecular
contamination (摘錄自IDRS 2020 Yield Enhancement Definitions for the Different Interface Points)

表2、IRDS 2020良率提升表面及環境污染控制的挑戰

Near-Term Difficult Challenges : 2019–2023 Description
Challenge #1 Control of electrically active and other particles Insufficient metrology and marginal treatment technology capability
in ultrapure water and liquid chemicals for advanced
semiconductor manufacturing(logic key driver)
Challenge #2 Control of electrically active and other particles Insufficient metrology and marginal treatment technology capability
in UPW of EUV mask production
Challenge #3 Critical organics in UPW Insufficient metrology for online speciation of organics
Challenge #4 Metals in H2O2 Insufficient metrology capability. Characterization needed for specific critical metals for
key process steps and segments.
Challenge #5 Slurry particle characterization and other Insufficient metrology capability
impurity monitoring
Challenge #6 Plating chemicals : particles>critical size Need reliable monitoring of large particles
(>0.150um) (#/ml)
Challenge #7 Liquid chemicals : particles>critical size(#/ml) Need reliable monitoring of particles<10nm. Need Filtration technology that is reliable
at the stated retention rating and that has minimal "rise up" contributions at the time
of install into the process.
Challenge #8 CMP slurries : large particles>MPS(#/ml) Need reliable LPC metrology that can measure targeted particles sizes and
concentrations that ignore the MPS sizes and do not require sample dilution to obtain
the measurement.
Challenge #9 Post-CMP(pCMP) cleans particles Some pCMP cleans will have volatile or highly reactive ingredients that form bubbles in
solution, therefore ; new metrology and new techniques will be needed to differentiate
between bubbles and real particles for contamination control. The pCMP cleans that
contain surfactants will have micelle particles and structures that are necessary for
the chemistry to perform the intended function. The need is for reliable and accurate
metrology to distinguish micelles from other foreign particles in solution.
Challenge #10 Particle measurement for ISO class 1 Need more efficient and effective laser particle counters with detection limit<<100nm
or CPC with sample flow>>0,1cfm
Challenge #11 AMC metrology Need of more sensitive gas analyzers for HCl, HF, HNO3, HBr, NH3, Total Acids, H2S,
SO2, organic acids, sulphuric acids and Total bases with detection limit<<100ppt
Challenge #12 Particle contribution by critical components and Insufficient analytical capability and unknown level of cleanliness
its control
Challenge #13 Critical metals in UPW for CMOS image sensors Insufficient metrology sensitivity beyond 200 ppq concentration
(摘錄自IDRS 2020 Yield Enhancement Difficult Challenges-2020-SECC)

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